Structure of heat dissipation substrate for power light emitting diode (LED) and a device using same

ABSTRACT

A structure of a heat dissipation substrate of power LEDs and a device made by using the same overcomes drawbacks such as complex structure of power LEDs, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of the heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other. The through hole is smaller than the blind hole, and both of them share the same direction of axis. The heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit.

FIELD

The disclosure relates to a structure of heat dissipation substrate of apower Light Emitting Diode (hereinafter LED) and a device including aheat dissipation substrate, especially to a heat dissipation substratewith a structure having a counterbore and a heat sink and a device usingthe heat dissipation substrate.

BACKGROUND INFORMATION

A LED, is a common component adopted in daily appliances due toadvantages such as small size, long service life, low driving voltage,low power consumption, quick response, and good shock resistance etc. Aworking LED light source will generate heat, a value of which is inproportion to its power value. Earlier LED devices had power limited tomilliwatts due to manufacturing technology. In recent years, newtechnologies were developed to enhance the power of LED devices and thusproducts using more power, for example, more than 100 milliwatts, weredeveloped and are referred to as a power LED. As power LEDs have beenapplied in the field of illumination, high power LEDs using power ofover 1 W have been developed and gradually applied in various areas ofillumination. The power LED will generate heat when working. After theLED light source has been working for a long time, its accumulated heatwill result in a short lifetime and unstable product performance. Inorder to resolve the problem of heat dissipation of a LED chip whenworking, prior art power LEDs adopted complex encapsulation structures.

Common supporting substrates used in prior art high power LEDs can bedivided into framework, ceramics substrate, etc. FIG. 1 shows anencapsulation structure of a framework type power LED, which includes aheat dissipation plate 102 in addition to an ordinary Plastic LeadedChip Carrier (hereinafter referred to as a PLCC). The frameworkstructure is characterized in that a white or black colloid 104 isplastic-sealed over a metal frame 103 to form a cavity, an electrodelead 103 and a heat dissipation plate 102 are fixed, a chip 105 and aheat sink 106 are mounted within a reflective cup of the heatdissipation plate 102, and an optical lens 108 is mounted on top of theframework.

FIG. 2 shows an encapsulation structure of a ceramics substrate typepower LED. The power LED is mainly characterized in that a chip 201 ismounted on a ceramic substrate 202 with a circuit printed thereon, withthe ceramic substrate 202 and its circuit together forming a structureof heat dissipation and an electric connection of LED. On the top of theceramic substrate 202 is mounted a metal reflective cavity 203, whichsupports a lens 204 and forms an optical structure. The ceramicsubstrate has a complex manufacturing process, low productionefficiency, high cost, and limited capability of heat dissipation, andthus limited room for power enhancement of LED devices based on theceramic substrate.

As production scale of the power LEDs has been expanded and anapplication field of power LEDs extended, the weaknesses of the productstructure mentioned above, such as complex processing, low productionefficiency etc., have become critical.

In order to cut down manufacturing cost, there has been developed asupport (i.e., substrate) of power LED by means of assembling a heatsink in a circuit plate. However, this kind of substrate hasdisadvantages such as complex structure, strict requirement ofmanufacture process, less reliability and bad heat dissipation, leadingto relatively high manufacturing costs, less reliability and shortlifetime of the power LEDs product.

For example, a PCT patent application WO2006104325 discloses assemblinga heat sink, in which, as shown in FIG. 3, multiple layers of circuitplates (301, 302, 303, 304, 4 layers in total) with through holes arestacked together to form a cavity for assembling a heat sink 305.However, these layers of circuit plates need to be stacked, assembledand welded, and there is a strict requirement for position in themanufacturing process. Also, when welding of the stacked circuit plates,defects such as inveracious soldering and an unflat joint may occur,leading to high manufacturing cost, high processing difficulty and lowproduction efficiency.

To overcome the problem of heat dissipation for a LED device, there is asolution of opening a hole in the heat dissipation plate and embedding aheat sink in the hole. For example, a Chinese patent CN1977399Adiscloses a solution, in which a LED substrate is obtained by means ofassembling a heat sink 404 with a circuit board 403, as shown in FIG. 4,a through hole structure 401 of the circuit board 403 is combined withthe heat sink 404, and the circuit board 403 or the heat sink 404 has aconical surface 402. This solution is not suitable for high power LEDdevices because of a lower heat dissipation capacity of the heat sink.During manufacture, the binding between the heat sink and the throughhole is weak so that the heat sink can easily break off and is difficultto locate. This results in low reliability and bad heat dissipation. Inaddition, the machining process of a conical surface on the circuitboard has bad consistency and thus product quality is hard to guarantee.

Furthermore, there is a problem of low production efficiency and highcost for mass production of LED products due to the complex structuresof heat dissipation substrate of the power LED. Therefore, there is aneed to develop a new product, which has high production efficiency,simple structure and low production cost, so as to meet demand of thebooming market.

SUMMARY

An objective of the disclosure is to overcome the drawbacks of priorart, i.e., complex structure, strict process requirement, lowfeasibility and bad heat dissipation of heat dissipation substrate inpower LEDs, and low manufacturing efficiency, bad product consistencyand reliability, and high product cost of the power LED devices.

Another objective of the disclosure is to provide a heat dissipationsubstrate with a heat sink assembled in a circuit board, and a power LEDdevice including the heat dissipation substrate. The heat dissipationsubstrate has a simple structure, is easy to manufacture, lowers processrequirements and can effectively solve heat dissipation problems of thepower LED devices, especially that of high power LED devices. The devicemanufactured by the heat dissipation substrate has good consistency,high reliability and good heat dissipation. The device still has highproduction efficiency, simple structure, low product cost, and can boostthe power of power LEDs. It can ensure that the power LED productaccording to the disclosure will satisfy the booming market.

To achieve the above objectives, a structure of heat dissipationsubstrate used for manufacturing a power LED is provided. The structureof heat dissipation substrate comprises: a circuit board, said circuitboard being of an one-piece structure and with a counterbore and metallines arranged thereon, wherein the counterbore is structured as athrough hole and a blind hole communicating with each other, the throughhole is smaller than the blind hole, and the axis direction of both thethrough hole and the blind hole are the same; The heat sink has anone-piece terraced structure formed by an upper terrace and a lowerterrace, wherein the diameter of the upper terrace is close to theaperture of the through hole and the diameter of the lower terrace isclose to the aperture of the blind hole, the height of the lower terraceof the heat sink is greater than or equal to the depth of the blindhole, the upper terrace and the lower terrace share the same directionof axis; the heat sink matches in structure with the counterbore, andthe heat sink can be embedded firmly in the counterbore. Due to itsone-piece structure, the structure of heat dissipation substratesimplifies complex multilayer structure existing in prior art circuitboard and effectively ensures process quality of the heat dissipationsubstrate. The heat sink and the circuit board are structured to enablea remarkably simple process for assembling the heat sink in thecounterbore of the heat dissipation substrate, by which the heat sinkcan be firmly fit, reliably positioned and uneasy to slip, thus theassembly quality is highly guaranteed. Furthermore, the lower terrace inthe one-piece structure of the head sink has a volume bigger than thatof the upper terrace, providing a heat sink with bigger thermal capacityand larger heat dissipation area; when assembled in the counterbore, thebottom of the heat sink is flush with or it extrudes from the printedcircuit board so that the heat sink may be enabled to contact with otherheat-transfer medium to dissipate the heat, thus achieving a very goodheat dissipation and greatly boosting the development of power LED. Thepower LED is designed to deliver high power. The heat dissipationsubstrate has a simple structure, is easy to manufacture and greatlyreduces product cost of the heat dissipation substrate of the power LED.

To achieve the above objectives, the device also provides a second heatdissipation substrate having a plurality of counterbores and heat sinks,with the heat dissipation substrate mentioned above acting as a basicelement thereof. The second heat dissipation substrate has a one-piececircuit board, at terminating ends of which position lines for cuttingare placed and within which slots and/or holes are placed. In thecircuit board, an array, M column×N rows, of counterbores is placed,wherein M and N are respectively integers more than or equal to 1, and Mand N cannot be equal to 1 simultaneously. Each of the heat sinks is inan interference fit with the corresponding counterbore of the array ofcounterbores. This second structure of heat dissipation substrateovercomes drawbacks existing in manufacturing process of power LEDs,such as, complex processes, power LEDs being manufactured piece by pieceand bad consistency of product. By simple design of the heat dissipationsubstrate, a plurality of power LEDs can be manufactured on the sameheat dissipation substrate. When manufacturing LED devices from the heatdissipation substrate, the substrate is first encapsulated with colloidand then cut along the position lines for cutting so that theencapsulated LED products can be divided into independent LED devices.The device simplifies manufacturing process of power LED devices, withproduction efficiency enhanced, production cost reduced, and goodconsistency of product quality achieved.

In order to meet the above objectives, the device provides a power LEDdevice manufactured by using the above heat dissipation substrate ofpower LED. The power LED device comprises a heat sink, the circuit boardwith a counterbore, a LED chip, bonding wires, and an encapsulationcolloid, wherein the heat sink is in an interference fit with thecounterbore of the circuit board, the LED chip is mounted on the heatsink, the lines of the circuit board, having internal wire connectionparts and external electrodes, act as device electrodes, with thebonding wires connecting LED chip electrodes to the internal wireconnection parts on the circuit board. Then, the encapsulation colloidis used to cover the side of the circuit board carrying the chip,keeping the external electrodes outside. The encapsulation colloidfunctions not only as a sealing layer for sealing the chip and thebonding wires from outside moisture and air, but also as an optical lensintegrated with the device. The above power LED device manufactured byusing the heat dissipation substrate has desirable heat dissipation,enabling a great power boost of the power LED device. It can bemanufactured in batches due to the heat dissipation substrate structureand simple encapsulation, providing good consistence for the power LEDdevices and achieving high production efficiency. More importantly, dueto the fact that the encapsulation colloid functions as an one-shotforming optical lens, the light extracting characteristic of the powerLED device has been improved when compared to a prior art device withlens assembled on encapsulation colloid. The power LED device has asimple and compact structure, high product reliability, and lowproduction cost. Because the heat dissipation substrate has a goodcharacteristic of heat dissipation, the power LED device manufactured byusing the heat dissipation substrate of the invention can use morepower. Thus the device can yield a LED device using high power. Usingthe simple and practical design of the heat dissipation substrateadopting the counterbore and heat sink, complex manufacturing technologyof LED can be simplified, production efficiency of a power LED devicecan be greatly improved and the lifetime of a power LED device can beextended.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a prior art encapsulation structure of lead framework typefor power LED;

FIG. 2 shows a prior art encapsulation structure of ceramics substratetype for power LED;

FIG. 3 shows a prior art structure of supporting substrate of power LEDmanufactured by assembling a heat sink with a circuit plate;

FIG. 4 shows a prior art structure of heat dissipation substratemanufactured by assembling a heat sink with a circuit board;

FIG. 5 shows a schematic diagram of heat dissipation substrate accordingto a first embodiment of the invention;

FIG. 6 shows schematic diagrams and sectional views of the assembly of acounterbore with a heat sink according to the first embodiment of theinvention;

FIG. 7 shows a schematic diagram of a preferred scheme of the firstembodiment of the invention;

FIG. 8 shows a schematic diagram of a preferred scheme of the firstembodiment of the invention;

FIG. 9 shows a schematic diagram of a preferred scheme of a secondembodiment of the heat dissipation substrate of the invention;

FIG. 10 shows a schematic diagram of a preferred scheme of the secondembodiment of the heat dissipation substrate of the invention;

FIG. 11 shows a schematic diagram of the heat dissipation substrateafter chip encapsulation according to the second embodiment of theinvention;

FIG. 12 shows a sectional view of power LED device according to anembodiment of the invention;

FIG. 13 shows a cubic chart of power LED device according to anembodiment of the invention.

REFERENCE NUMBER

-   1 circuit board; 2 counterbore: through hole 2 a, blind hole 2 b; 3    metal line, device electrode: internal wire connection part 3 a,    external electrode 3 b; 4 heat sink: upper terrace 4 a, lower    terrace 4 b; 5 position line for cutting; 6 slot; 7 hole; 8 LED    chip; 9 bonding wire; 10: encapsulation colloid.

DETAILED DESCRIPTION Embodiment 1

Referring to FIG. 5 and FIG. 6, a preferred embodiment 1 of the heatdissipation substrate used for manufacturing power LED will bedescribed. In this embodiment, FIG. 5 and FIG. 6 show a basic schematicdiagram of a circuit board 1 and a heat sink 4 forming a heatdissipation substrate. FIG. 5A illustrates the upper surface of the heatdissipation substrate, FIG. 5B illustrates the lower surface of the heatdissipation substrate, FIG. 5C shows a sectional view of the heatdissipation substrate with the heat sink 4 embedded in the counterbore2, and FIGS. 5D and 5E respectively show a cubic chart and a sectionalview of the heat sink. In the embodiment, the circuit board 1 has aone-piece structure, on which a counterbore 2 and metal lines 3 areplaced, wherein the metal lines 3 act as electrodes of the device, andinclude internal wire connection parts 3 a and external electrodes 3 b.The counterbore includes two holes, through hole 2 a and blind hole 2 b,communicating with each other. The through hole 2 a is smaller than theblind hole 2 b, and both of the through hole 2 a and the blind hole 2 bshare the same direction of axis and are perpendicular to the upper andlower surfaces of the circuit board 1. The heat sink 4 has a one-pieceterraced structure formed by an upper terrace 4 a and a lower terrace 4b, wherein the diameter of the upper terrace 4 a is close to theaperture of the through hole 2 a, and that of the lower terrace 4 b isclose to the aperture of the blind hole 2 b, and the upper terrace 4 ashares the same direction of axis as the lower terrace 4 b. Because theheat sink is in match with the counterbore 2, the heat sink 4 can beembedded in the counterbore 2 to fit firmly with each other; preferably,the heat sink 4 may be embedded in the counterbore 2 by means of aninterference fit or by bonding with adhesive.

FIG. 6 shows a schematic diagram of the circuit board 1 according to apreferred scheme of the invention, with the counterbore 2 and the heatsink 4 being assembled. As regard to the height of the heat sink 4, theheight of the lower terrace 4 b of the heat sink is preferably equal toor greater than the depth of the blind hole 2 b, so that the bottom ofthe heat sink 4 after assembly is flush with or extrudes from thecircuit board 1, in this way the heat sink 4 is easier to contact theheat-transfer medium to dissipate the heat. In another preferredembodiment, the height of the upper terrace 4 a of the heat sink isequal to or greater than the depth of the through hole 2 a so that thetop of the heat sink 4 after assembly is flush with or extrudes from thecircuit board 1. In this way the LED chip achieves a good lightextracting effect when being assembled on the top of the heat sink.

According to FIG. 7 and FIG. 8, preferred embodiments for manufacturingpower LED of the invention will be described as below. As shown in FIG.7 and FIG. 8, in the embodiment, the cross section of the blind hole 2 band the through hole 2 a may be arbitrary rotundity or polygon,respectively. In the invention, the arbitrary rotundity means round,oval or irregular rotundity, and the arbitrary polygon means a polygonformed by arcs, straight lines, or a combination of arcs and straightlines. Preferably, the cross section of the blind hole 2 b may be roundand that of the through hole 2 a may be round or square. The crosssection of the lower terrace 4 b of the heat sink 4 may be an arbitraryrotundity or an arbitrary polygon corresponding to that of the blindhole 2 b, and the cross section of the upper terrace 4 a may be anarbitrary rotundity or an arbitrary polygon corresponding to that of thethrough hole 2 a. The diameter of the upper terrace 4 a is close to theaperture of the through hole 2 a and the diameter of the lower terrace 4b is close to the aperture of the blind hole 2 b, so that the heat sink4 can be embedded in the counterbore 2 to make a firm fit therewith.FIG. 7A shows a preferred scheme, in which the top of upper terrace 4 aof the heat sink is a planar surface or a concave reflective cup. FIG.8A shows that the through hole 2 a and the blind hole 2 b share the samedirection of axis and they may or may not be coaxial. Preferably, thethrough hole 2 a and the blind hole 2 b are not coaxial.Correspondingly, the upper terrace 4 a and the lower terrace 4 b sharethe same direction of axis and may or may not be coaxial. Preferably theupper terrace 4 a and the lower terrace 4 b are not coaxial so that theheat sink 4 is easier to be mounted and fit in the counterbore 2. FIG.8B further shows a preferred scheme in which the top of the upperterrace 4 a of the heat sink has a cross section slightly smaller thanthat of the bottom of the upper terrace 4 a so that the upper terrace 4a presents a conical shape, and the top of the lower terrace 4 b has across section slightly smaller than that of the bottom of the lowerterrace 4 b so that the lower terrace 4 b presents a conical shape.Preferably the height of the lower terrace 4 b of the heat sink is equalto or greater than the depth of the blind hole 2 b so that it is easy toassemble the heat sink by interference fit or bonding with adhesive.

Embodiment 2

According to FIG. 9, FIG. 10 and FIG. 11, a heat dissipation substrateof a preferred embodiment 2 of the invention used for manufacturing apower LED is shown and will be described as blow.

FIG. 9 shows a heat dissipation substrate having a plurality ofcounterbores, with the heat dissipation substrate of the previousembodiment acting as its basic element. The heat dissipation substratehas a one-piece circuitboard, on or in which position lines for cutting5, slots 6 and/or holes 7 (not shown) are placed; an array, M column×Nrow, of counterbores is placed in the circuit board, wherein M and N areintegers greater than or equal to 1, and M and N can not be equal to 1simultaneously. There are a plurality of position lines for cutting 5,each corresponding to either end of each counterbore column and/or row;there are a plurality of slots 6 and/or holes 7, which are placed at theside of each counterbore column and/or row (as shown in FIG. 10, thereis of a hole 7 set at the side of each counterbore). The heat sinks areembedded in the corresponding counterbores and fit firmly with them byan interference fit or by adhesive. The interference fit is preferred.

There is a preferred scheme: as shown in FIG. 9, M+1 position lines forcutting 5 are placed at either end of each counterbore column on thecircuit board, each corresponding to the middle between two adjacentcounterbore columns; each of N+1 slots 6 is located in the middlebetween two adjacent counterbore rows, extending along the counterborerows. In FIG. 9, with respect to an array of counterbores with 5 columnsand 4 rows, there are six position lines for cutting 5 and five slots 6.In this preferred scheme, the device electrodes 3 are placed on theupper, lower and inner surfaces at both sides of the slots on thecircuit board.

FIG. 10 shows another preferred scheme according to the embodiment 2 ofthe invention. N+1 position lines for cutting 5 a are placed at ends ofcounterbore rows on the circuit board, each corresponding to the middlebetween two adjacent counterbore rows (for example, in FIG. 10, withrespect to an array of counterbores with 5 columns×4 rows, there are 5position lines for cutting 5 a); M+1 position lines for cutting 5 b areplaced at ends of counterbore columns on the circuit board, eachcorresponding to the middle between two adjacent counterbore columns(for example, in FIG. 10, six position lines for cutting 5 b are shown);the plurality of slots 6 (not shown) and/or hole 7 are collinear withthe position lines for cutting placed at both ends of counterborecolumns or rows. Preferably, a slot 6 or a hole 7 is arranged at eitherside of each counterbore 2 of every counterbore row or column on thecircuit board 1. On the circuit board 1, device electrodes 3 arearranged along both sides of the plurality of slots and/or holes atplaces that correspond to the counterbores, and internal wire connectionparts 3 a, each corresponding to a counterbore, are arranged. The deviceelectrodes 3 are arranged on the upper, lower and inner surfaces at bothsides of the said slot 6 or hole 7 on the circuit board. As shown inFIG. 10, a plurality of holes 7 are lined up along and at sides ofrespective counterbore rows, each hole 7 corresponding to eachcounterbore. Of course, the hole 7 may be replaced by slot 6 accordingto the above scheme.

FIG. 11 shows a cubic chart of a power LED device manufactured byencapsulating the heat dissipation substrate of preferred schemes in theprevious embodiment of the invention. If it is cut along the positionlines for cutting, independent power LED devices as shown in FIG. 13 canbe easily obtained.

FIG. 12 shows a schematic diagram of power LED device manufactured withthe heat dissipation substrate of the invention. The device comprises: aheat sink 4, a circuit board 1 with a counterbore structure, a LED chip8, bonding wires 9, encapsulation colloid 10, and device electrodes 3.Wherein, the heat sink 4 fits firmly with the counterbore 2 of thecircuit board 1; the LED chip 8 is mounted on the heat sink 4; the metallines 3, including internal wire connection parts 3 a and externalelectrodes 3 b of circuit board 1, form electrodes 3; and, the bondingwires 9 connect the electrodes of the LED chip to the internal wireconnection parts on the circuit board 1; the encapsulation colloid 10covers the side of the circuit board 1 carrying the chip and keeps theexternal electrodes 3 b outside; the encapsulation colloid 10 functionsnot only as a sealing layer for sealing the chip and the bonding wire,but also as an optical lens integrated with the device. Preferably, theoptical lens integrated with the device may be a convex lens, a concavelens or a combined toroidal lens. Furthermore, the number of chipsarranged on the heat sink may be 1 or more than 1.

In comparison with the prior art power LEDs, the power LED device of theinvention is simple and compact. The power LED device manufactured withthe heat dissipation substrate offers room for power enhancement, and isespecially suitable to achieve a LED device with high power, so as toachieve the aim of manufacturing a power LED device with highperformance, high quality at low cost and high efficiency.

1. A structure of a heat dissipation substrate for manufacturing a powerLED, wherein the structure of the heat dissipation substrate comprises:a one-piece printed circuit board, on which a counterbore and metallines are arranged; wherein, the counterbore is perpendicular to asurface of the printed circuit board and structured as a through holeand a blind hole communicating with each other, the through hole issmaller than the blind hole and both the through hole and the blind holeshare a same direction of axis; a heat sink, having one-piece terracedstructure formed by an upper terrace and a lower terrace, wherein adiameter of the upper terrace is close to an aperture of the throughhole and a diameter of the lower terrace is close to an aperture of theblind hole; the upper terrace and the lower terrace share the samedirection of axis and they are perpendicular to upper and lower surfacesof the printed circuit board; a height of the lower terrace is greaterthan or equal to a depth of the blind hole; wherein, the heat sink is inmatch with the counterbore and the heat sink is embedded in thecounterbore to form a firm fit.
 2. The structure of heat dissipationsubstrate according to claim 1, wherein: the cross section of the blindhole is circular or polygon, and that of the through hole is circular orpolygon; the cross section of the lower terrace of the heat sink iscircular or polygon, corresponding to that of the blind hole, and thecross section of the upper terrace of the heat sink is circular orpolygon, corresponding to that of the through hole.
 3. The structure ofheat dissipation substrate according to claim 1, wherein the height ofthe upper terrace of the heat sink is equal to or greater than the depthof the through hole.
 4. The structure of heat dissipation substrateaccording to claim 1, wherein there is a planar or concave reflectivecup on the top of the upper terrace of the heat sink.
 5. The structureof heat dissipation substrate according to claim 1 wherein the throughhole and the blind hole are not coaxial, and correspondingly the upperterrace and the lower terrace are not coaxial.
 6. The structure of heatdissipation substrate according to claim 1 wherein the through hole andthe blind hole are coaxial, and the upper terrace and the lower terraceare coaxial.
 7. The structure of heat dissipation substrate according toclaim 2, wherein the cross sections of the blind hole and the lowerterrace are circular, and that the cross sections of the through holeand the upper terrace are circular or square.
 8. The structure of heatdissipation substrate according to claim 1, wherein the upper terrace ofthe heat sink presents a shape of a cone, with its top smaller in crosssection than its bottom; and, the lower terrace of the heat sinkpresents a shape of a cone, with its top smaller in cross section thanits bottom.
 9. The structure of heat dissipation substrate according toclaim 1, wherein the heat sink and the counterbore are fit firmly witheach other by an interference fit or bonded by adhesive.
 10. Thestructure of heat dissipation substrate according to claim 1, wherein atan end of the one-piece printed circuit board, position lines forcutting are arranged, and in the one-piece printed circuit board atleast one of slots and holes are arranged.
 11. A power LED devicemanufactured by using the structure of heat dissipation substrateaccording to claim 1, wherein the device comprises: a heat sink, aprinted circuit board with a counterbore, a LED chip, bonding wires, anencapsulation colloid, wherein, the heat sink fits firmly with thecounterbore of the printed circuit board; the LED chip is mounted on theheat sink; the metal lines of the printed circuit board, having internalwire connection parts and external electrodes, form device electrodes,and bonding wires connect electrodes of the LED chip to the internalwire connection parts on the printed circuit board; the encapsulationcolloid covers the side of the printed circuit board carrying the chipand keeps the external electrodes outside, and the encapsulation colloidfunctions as a sealing layer for sealing the chip and the bonding and asan optical lens integrated with the device.
 12. The power LED deviceaccording to claim 11, wherein an optical lens integrated with thedevice is a convex lens, concave lens or combined toroidal lens; theexternal electrodes function as positive and negative electrodes of thedevice, the number of the chip arranged on the heat sink may be atleast
 1. 13. A structure of a heat dissipation substrate formanufacturing a power LED, wherein the structure of the heat dissipationsubstrate comprises: a one-piece printed circuit board, on which acounterbore and metal lines are arranged; wherein, the counterbore isperpendicular to a surface of the printed circuit board and structuredas a through hole and a blind hole communicating with each other, thethrough hole is smaller than the blind hole and both the through holeand the blind hole share a same direction of axis; a heat sink, havingone-piece terraced structure formed by an upper terrace and a lowerterrace, wherein a diameter of the upper terrace is close to an apertureof the through hole and a diameter of the lower terrace is close to anaperture of the blind hole; the upper terrace and the lower terraceshare the same direction of axis and they are perpendicular to upper andlower surfaces of the printed circuit board, a height of the lowerterrace is greater than or equal to a depth of the blind hole; whereinthe heat sink is in match with the counterbore and the heat sink isembedded in the counterbore to form a firm fit; wherein at an end of theone-piece printed circuit board, position lines for cutting arearranged, and in the one-piece printed circuit board at least one ofslots and holes are arranged; wherein a counterbore array, having Mcounterbore columns and N counterbore rows, is arranged on the circuitboard, wherein M and N are respectively integers equal to or greaterthan 1, and they could not be equal to 1 simultaneously; the number ofthe position lines for cutting is more than 1, and each position linefor cutting corresponds to a side of each counterbore column or eachcounterbore row; the number of the slots and/or the holes is more than1, and each slot and/or hole is arranged by the side of each counterborecolumn or each counterbore row; the heat sink is embedded in eachcounterbore, and each pair of heat sinks and counterbores are fit firmlytogether by an interference fit or bonded firmly by adhesive.
 14. Thestructure of heat dissipation substrate according to claim 13, whereineach of M+1 position lines for cutting is arranged at either end ofcounterbore columns on the circuit board, corresponding to the middlebetween two adjacent counterbore columns; the number of slots is N+1,and each slot is a through slot, extending along the side of eachcounterbore row and being located in the middle between two adjacentcounterbore rows.
 15. The structure of heat dissipation substrateaccording to claim 14, wherein device electrodes are arranged along bothsides of the slots on the printed circuit board.
 16. The structure ofheat dissipation substrate according to claim 15, wherein each deviceelectrode corresponds to each counterbore and an internal wireconnection part.
 17. The structure of heat dissipation substrateaccording to claim 16, wherein the device electrodes are arranged onupper, lower and inner surfaces of the printed circuit board at bothsides of each slot.
 18. The structure of heat dissipation substrateaccording to claim 13, wherein M+1 position lines for cutting arearranged at ends of counterbore columns on the circuit board, eachcorresponding to the middle between two adjacent counterbore columns;N+1 position lines for cutting are arranged at ends of counterbore rowson the printed circuit board, each corresponding to the middle betweentwo adjacent counterbore rows; a plurality of slots and/or holes arearranged at both sides of each counterbore column or row.
 19. Thestructure of heat dissipation substrate according to claim 18, whereinthe plurality of slots and/or holes are co-linear with the positionlines for cutting arranged at both ends of counterbore columns or rows.20. The structure of heat dissipation substrate according to claim 19,wherein at least one slot or hole is arranged at the side of eachcounterbore in every counterbore column or row.
 21. The structure ofheat dissipation substrate according to claim 19, wherein deviceelectrodes are arranged at both sides of the plurality of slots and/orholes on the printed circuit board, each corresponding to a counterboreand an internal wire connection part.
 22. The structure of heatdissipation substrate according to claim 21, wherein the deviceelectrodes are arranged on the upper, lower and inner surfaces of theslots or holes on the printed circuit board.